1.1 Features
- GaN-on-Silicon E-mode HEMT technology
- Very low gate charge
- Ultra-low on resistance
- Very small package size
- Zero reverse recovery charge
100V Enhancement-mode GaN Power Transistor
GaN-on-Silicon enhancement mode high-electron-mobility-transistor (HEMT) in Solder Ball WLCSP with 3.5 mm x 2.13 mm package size.
Parameter | Value |
---|---|
VDS,max | 100V |
RDS(on),max @ VGS = 5V | 3.2mΩ |
QG,typ @ VDS = 50V | 9.2nC |
ID,pulse | 230A |
QOSS @ VDS = 50V | 50nC |