1.1 Features
- GaN-on-Silicon E-mode HEMT technology
- Very low gate charge
- Ultra-low on resistance
- Very small footprint
60V Enhancement-mode GaN Enhancement-mode Power Transistor.
GaN-on-Silicon enhancement mode high-electron-mobility-transistor (HEMT) in FCQFN with 4 mm x 3 mm package size.
Platform (S060E2.5) | ||||
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Product (INN060FQ043A) | ||||
Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
MSL3 | Ta=30°C, RH=60%, 3 x reflow, 192hrs | 25 x 3 | 0 Fail | Pass |
HTRB | Tj=125°C, VD=48V, 1000hrs | 77 x 3 | 0 Fail | Pass |
HTRB | Tj=150°C, VD=48V, 1000hrs | 77 x 1 | 0 Fail | Pass |
HTGB(+) | Tj=150°C, VG=6.0V, 1000hrs | 77 x 3 | 0 Fail | Pass |
HTGB(-) | Tj=150°C, VG=-4.0V, 1000hrs | 77 x 3 | 0 Fail | Pass |
TC | -40 to +125°C, Air, 1000Cys | 77 x 3 | 0 Fail | Pass |
H3TRB | Ta=85°C, RH=85%, VD=48V, 1000hrs | 77 x 3 | 0 Fail | Pass |
uHAST | T=130℃, RH=85%, 96hrs | 77 x 3 | 0 Fail | Pass |
Solderability | Pre-Con: 8hrs Pb-free: 245±5°C, 5±0.5s | 22 x 3 | 0 Fail | Pass |
DHTOL | BUCK, Vin=36V, Vout=18V, Fsw=600KHz, Tj=125°C, 1000hrs | 8 x 3 | 0 Fail | Pass |
HBM | All Pins | 3 x 1 | 0 Fail | Class 1B |
CDM | All Pins | 3 x 1 | 0 Fail | Class 2a |
Parameter | Value |
---|---|
VDS,max | 60V |
RDS(on),max @ VG = 5 V | 4.3mΩ |
QG,typ @ VDS = 30 V | 6.2nC |
ID, Pulse | 160A |
QOSS@ VDS = 30V | 18nC |