1.1 Features
- GaN-on-Silicon E-mode HEMT technology
- Very low gate charge
- Ultra-low on resistance
- Very small footprint
100V Enhancement-mode GaN Power Transistor
GaN-on-Silicon enhancement mode high-electron-mobility-transistor (HEMT) in FCQFN with 3.0 mm x 5.0 mm package size.
Platform (S100E2.0) | ||||
---|---|---|---|---|
Product (INN100FQ025A) | ||||
Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
MSL3 | T=30°C, RH=60%, 3 x reflow | 0 Fail | 25 x 3 | Pass |
HTRB | T=150°C, VD=80V | 0 Fail | 77 x 1 | Pass |
HTGB | T=150°C, VG=5.5V | 0 Fail | 77 x 1 | Pass |
PLTC | -55℃to +150℃ | 0 Fail | 77 x 3 | Pass |
H3TRB | T=85°C, RH=85%, VD=80V/120V | 0 Fail | 77 x 3 | Pass |
HAST | T=130°C, RH=85%, VD=42V | 0 Fail | 77 x 3 | Pass |
HTSL | T=150°C | 0 Fail | 77 x 3 | Pass |
Solderability | 1.Precondition : 8H 2. Pb-feee,245±5℃,5±0.5S. |
0 Fail | 10 x 1 | Pass |
HBM | All Pins | 0 Fail | 3 x 1 | Class 2 |
CDM | All Pins | 0 Fail | 3 x 1 | Class C3 |
Parameter | Value |
---|---|
VDS,max | 100V |
RDS(on),max @ VG = 5 V | 2.8mΩ |
QG,typ @ VDS = 50 V | 14nC |
ID,DC | 320A |
QOSS @ VDS = 50 V | 85nC |