1.1 Features
- GaN-on-Silicon E-mode HEMT technology
- Very low gate charge
- Ultra-low on Resistance
- Very small package size
- Zero reverse recovery charge
150V Enhancement-mode GaN Power Transistor
GaN-on-Silicon enhancement mode high-electron-mobility-transistor(HEMT) in Flip chip LGA (FCLGA) with 3.2mm x 2.2mm package size.
Platform (S150E2.0) | ||||
---|---|---|---|---|
Product (INN150LA070A) | ||||
Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
MSL3 | T=30°C, RH=60%, 3 x reflow, 192hrs | 25 x 3 | 0 Fail | Pass |
HTRB | T=150°C, VD=120V, 1000hrs | 77 x 3 | 0 Fail | Pass |
HTGB | T=150°C, VG=5.5V, 1000hrs | 77 x 3 | 0 Fail | Pass |
HTSL | T=150°C | 77 x 3 | 0 Fail | Pass |
TC | -40 to +125°C, Air, 1000Cys | 77 x 3 | 0 Fail | Pass |
HAST | T=130°C, RH=85%, VD=42V, 96hrs | 77 x 3 | 0 Fail | Pass |
HTOL | QR system: Tj=125°C, Vplatform=120V, Power out=120W, Vout=20V, f=130KHz |
8 x 3 | 0 Fail | Pass |
HBM | All Pins | 3 x 1 | 0 Fail | Class 1B |
CDM | All Pins | 3 x 1 | 0 Fail | Class C2b |
High Efficiency:93% @90Vac
Small Size:85mm*50mm*23mm
High Power Density:23W/in3
Notebook USB PD3.1
Power Tools
Parameter | Value |
---|---|
VDS,max | 150V |
RDS(on),max @ VGS = 5 V | 7mΩ |
QG,typ @ VDS = 85 V | 7.6nC |
ID,pulse | 120A |
QOSS @ VDS = 85 V | 47nC |