1.1 特性
-
支持双向导通,无反向恢复
-
超低导通电阻
-
6mm x 4mm FCQFN封装,寄生参数小
40V双向导通增强型场效应晶体管
基于先进的VGaN技术及极低导通电阻的双向导通40V硅基氮化镓增强型高电子迁移率晶体管,采用6mm x 4mm FCQFN封装。
支持双向导通,无反向恢复
超低导通电阻
6mm x 4mm FCQFN封装,寄生参数小
高侧负载开关
智能手机USB端口中的OVP保护
多电源系统中的开关电路
Platform (B040E2.5) | ||||
---|---|---|---|---|
Product (INN040FQ012A) | ||||
Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
MSL3 | T=30°C, RH=60%, 3 x reflow, 192hrs | 25 x 2 | 0 Fail | Pass |
HTRB | T=125°C, VD1=32V, 168hrs | 77 x 1 | 0 Fail | Pass |
HTRB | T=125°C, VD2=32V, 168hrs | 77 x 1 | 0 Fail | Pass |
HTGB | T=125°C, VG=5.5V, 168hrs | 77 x 1 | 0 Fail | Pass |
TC | -40 to +125°C, Air, 1000Cys | 77 x 3 | 0 Fail | Pass |
H3TRB | T=85°C, RH=85%, VD1=32V, 1000hrs | 77 x 3 | 0 Fail | Pass |
H3TRB | T=85°C, RH=85%, VD2=32V, 1000hrs | 77 x 3 | 0 Fail | Pass |
HTSL | T=150°C, 1000hrs | 77 x 3 | 0 Fail | Pass |
HTOL | Tj=125°C, Load current=25A, 168hrs | 8 x 1 | 0 Fail | Pass |
Drop test | Accelerometer: 1500G Durations: 0.5ms, 90Drops | 77 x 1 | 0 Fail | Pass |
Solderability | Pre-Con: 8hrs Pb-free: 245±5°C, 5±0.5s | 25 x 3 | 0 Fail | Pass |
HBM | All Pins | 3 x 1 | 0 Fail | Class 1B |
CDM | All Pins | 3 x 1 | 0 Fail | Class C2b |
小尺寸: L105mm*D80mm*H18mm
最大带载电流:200A
控制简单: PRT (low: off; high: on)
低温升: 25.3℃(200A@Ta=25℃,2.5m/s airflow,10pcs in parallel)
自带电池反接保护
负载开关
Parameter | Value |
---|---|
VDD,max | 40V |
RDD(on),max @ VG = 5 V | 1.2mΩ |
QG,typ @ VDD = 20 V | 60nC |
ID,DC | 100A |