1.1 特性
- 8英寸硅基氮化镓技术
- 极低栅极电荷
- 超低导通电阻
- 体积非常小
100V增强型GaN功率晶体管
基于先进的GaN技术的100V硅基氮化镓增强型高电子迁移率晶体管,采用FCQFN 3mmX5mm 封装。
Platform (S100E2.0) | ||||
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Product (INN100FQ025A) | ||||
Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
MSL3 | T=30°C, RH=60%, 3 x reflow | 0 Fail | 25 x 3 | Pass |
HTRB | T=150°C, VD=80V | 0 Fail | 77 x 1 | Pass |
HTGB | T=150°C, VG=5.5V | 0 Fail | 77 x 1 | Pass |
PLTC | -55℃to +150℃ | 0 Fail | 77 x 3 | Pass |
H3TRB | T=85°C, RH=85%, VD=80V/120V | 0 Fail | 77 x 3 | Pass |
HAST | T=130°C, RH=85%, VD=42V | 0 Fail | 77 x 3 | Pass |
HTSL | T=150°C | 0 Fail | 77 x 3 | Pass |
Solderability | 1.Precondition : 8H 2. Pb-feee,245±5℃,5±0.5S. |
0 Fail | 10 x 1 | Pass |
HBM | All Pins | 0 Fail | 3 x 1 | Class 2 |
CDM | All Pins | 0 Fail | 3 x 1 | Class C3 |