1.1 特性
- 8英寸硅基氮化镓技术
- 极低栅极电荷
- 超低导通电阻
- 体积非常小
40V增强型GaN增强型功率晶体管
基于先进的GaN技术的40V硅基氮化镓增强型高电子迁移率晶体管,采用FCQFN 4mmX3mm 封装。
Platform (S040E2.5) | ||||
---|---|---|---|---|
Product (INN040FQ043A) | ||||
Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
MSL3 | Ta=30°C, RH=60%, 3 x reflow, 192hrs | 25 x 3 | 0 Fail | Pass |
HTRB | Tj=150°C, VD=40V, 1000hrs | 77 x 3 | 0 Fail | Pass |
LTRB | Tj=-40°C, VD=32V, 1000hrs | 77 x 3 | 0 Fail | Pass |
HTGB(+) | Tj=150°C, VG=6.0V, 1000hrs | 77 x 3 | 0 Fail | Pass |
HTGB(-) | Tj=150°C, VG=-4.0V, 1000hrs | 77 x 3 | 0 Fail | Pass |
LTGB(+) | Tj=-40°C, VG=6.0V, 1000hrs | 77 x 3 | 0 Fail | Pass |
LTGB(-) | Tj=-40°C, VG=-4.0V, 1000hrs | 77 x 3 | 0 Fail | Pass |
TC | -40 to +125°C, Air, 1000Cys | 77 x 3 | 0 Fail | Pass |
H3TRB | Ta=85°C, RH=85%, VD=32V, 1000hrs | 77 x 3 | 0 Fail | Pass |
HAST | T=130°C, RH=85%, Vd=32V, 96hrs | 77 x 3 | 0 Fail | Pass |
uHAST | T=130°C, RH=85%, 96hrs | 77 x 3 | 0 Fail | Pass |
Solderability | Pre-Con: 8hrs Pb-free: 245±5°C, 5±0.5s | 25 x 3 | 0 Fail | Pass |
DHTOL | BUCK, Vin=32V, Vout=13.5V, Iout=10A, Fsw=1.2MHz, Tj=125°C, 1000hrs | 22 x 3 | 0 Fail | Pass |
HBM | All Pins | 3 x 1 | 0 Fail | Class 1B |
CDM | All Pins | 3 x 1 | 0 Fail | Class 2a |
高效率 98.1% @24Vin、19.2V/6A、600kHz;
可调频: 400KHz~1200KHz
可调压:3.3V~19.2V
Car Charger;
Notebooks;
Tablet PCs
Parameter | Value |
---|---|
VDS,max | 40V |
RDS(on),max @ VG = 5 V | 4.3mΩ |
QG,typ @ VDS = 20 V | 6.2nC |
ID, Pulse | 160A |
QOSS@ VDS = 20V | 14nC |