1.1 特性
- 硅基氮化镓增强型高电子迁移率晶体管技术
- 极低栅极电荷
- 极低导通电阻
- 超小封装尺寸
- 零反向恢复电荷
100V增强型氮化镓功率半导体
采用Solder Bar WLCSP 3.5mm x 2.13mm封装的硅基氮化镓增强型高电子迁移率晶体管
英诺赛科的增强型氮化镓场效应晶体管在参考硅基功率MOSFET的条件下经过了全面的可靠性测试,这些测试项目及结果如下所示:
Platform (S100E2.0) | ||||
---|---|---|---|---|
Product (INN100W032A) | ||||
Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
MSL1 | T=85°C, RH=85%, 3 x reflow | 0 Fail | 25 x 3 | Pass |
HTRB | T=150°C, VD=80V | 0 Fail | 77 x 3 | Pass |
HTGB | T=150°C, VG=5.5V | 0 Fail | 77 x 3 | Pass |
BLTC | -40 to +125°C, Air | 0 Fail | 77 x 3 | Pass |
H3TRB | T=85°C, RH=85%, VD=80V | 0 Fail | 77 x 3 | Pass |
HAST | T=130°C, RH=85%, VD=42V | 0 Fail | 77 x 3 | Pass |
HTSL | T=150°C | 0 Fail | 77 x 3 | Pass |
HTOL | LLC, Vin=60V, Fsw=1MHz, Tj>125°C | 0 Fail | 10 x 3 | Pass |
HBM | All Pins | 0 Fail | 3 x 1 | Class 1C |
CDM | All Pins | 0 Fail | 3 x 1 | Class C3 |